Ethernity Networks on Monday announced it has released the ENET Wireless Backhaul solution, designed for standalone FPGA-based appliances.
The solution combines up to 60 Gbps of networking capacity with newly patented bonding technology for optimizing 4G and 5G network deployments. The ENET Wireless Backhaul solution utilizes Ethernity’s ENET Flow Processor FPGA firmware coupled with Ethernity’s newly patented bonding technology to run on an FPGA appliance.
The integrated bonding technology evenly distributes wireless traffic over multiple 1 GbE and 10 GbE ports. It offers the ability to support fragmentation, reassembly, and reordering of packets for differential delay compensation as a means to connect wireless radio equipment.
The solution also ensures optimum wireless performance and improves transmitted throughput by dynamically distributing data along multiple wireless links of different speeds and technologies. This enables operators to overcome interruptions or slow wireless transmission due to inclement weather, as well as to increase maximum transmission distance.
ENET Wireless Backhaul is ideal for implementing within a 4G/5G Indoor or Outdoor Unit with complete Carrier Ethernet Switch/Router functionality and the embedded bonding feature.
Oded Bergman, Ethernity VP of Products and Business Development
By incorporating Ethernity’s unique bonding solution for 1G and 10G links, together with our L2/L3/MPLS ENET Flow Processor, the ENET Wireless Backhaul solution provides unmatched all-weather wireless backhaul resiliency with the highest performance over different radio technologies.
