Ranovus announced a strategic collaboration with IBM, TE Connectivity and Senko Advanced Components to create an ecosystem to design and manufacture multi-vendor solutions for Co-Packaged Optics applications in data center.
The collaboration leverages:
1- RANOVUS’ highly scalable Odin silicon photonics engine that incorporates the company’s innovation in multi-wavelength Quantum Dot Laser (QDL), 100Gbps Silicon Photonics based Micro Ring Resonator modulators and photodetectors, 100Gbps Driver, 100Gbps TIA and control Integrated Circuits in a power efficient and cost-effective EPIC in a single chip.
2- IBM’s innovative fiber V-groove interconnect packaging technology is a robust and reliable assembly technique to interface optical fibers to silicon photonics devices.
3- TE’s co-packaged (CP) fine pitch socket interposer technology enables integration of small chipset and optical engine component technologies into high-value co-package assemblies with reworkable and interoperable interfaces.
4- SENKO’s fiber optic connectivity solutions for optical coupling, on-board/mid-board, and faceplate to support 100Gbps/lane and beyond Co-Packaged Optics equipment designs.
With data center traffic growing at an unprecedented pace, the networking infrastructure needs to scale in capacity while maintaining its total power consumption and footprint. Today’s disaggregated Ethernet switch IC and optical module architecture does not provide the scalability required to support the future growth of the data centers, said Ranovus. Co-packaging of optics and Ethernet switch ICs is a natural next step to reduce the power consumption burden of the electrical I/Os in the data center networking equipment. The transition of the Ethernet switch IC SER/DES from 50Gbps to 100Gbps, in 25.6Tbps and 51.2Tbps switch configurations, presents a unique inflection point in the architecture of the Ethernet switch systems.
Georg Roell, CTO, Ranovus
RANOVUS’ Odin platform was conceived with miniaturized components such as Micro Ring Resonators in a monolithic Electronic and Photonic Integrated Circuit to deliver highly scalable solutions in support of single and multi-wavelength applications.
Paul Fortier, Senior Engineer, IBM Business Development
IBM’s optical assembly processes leverage our automated high-volume semiconductor packaging and IBM’s Assembly and Test division provides the co-packaged optics ecosystem with a seamless end to end manufacturing capability.
