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Ranovus, IBM, TE Connectivity & Senko Partner for Delivery of Co-Packaged Optics Solution in DC

Ranovus announced a strategic collaboration with IBM, TE Connectivity and Senko Advanced Components to create an ecosystem to design and…

Ranovus Launches New Single Chip Silicon Photonic Engine to Support ML/AI Workloads

Ranovus on Thursday announced the launch of its new single chip silicon photonic engine, Odin platform which the company claims…