Qualcomm has formed a $3 billion JV with Japan's TDK for the supply of key components and modules for mobile devices and fast-growing business segments such as the Internet of Things (IoT), drones, robotics and automotive applications.
In addition to creating a new entity, RF360 Holdings where Qualcomm will own a stake of 51%, both compnies will expand their collaboration around key technology fields including sensors, MEMS and wireless charging. Qualcomm has an option to acquire the remaining interest in the joint venture 30 months after the closing of the deal, expected to take place in early 2017.
Steve Mollenkopf, CEO of Qualcomm
TDK is a leading electronic components manufacturer with cutting-edge expertise in RF filters and modules, and we are looking forward to deepening our collaboration and together accelerating innovation and better serving the ecosystem for next-generation mobile communications.
Takehiro Kamigama, President and CEO of TDK
Customers will benefit from our unique and comprehensive portfolio, which will further strengthen TDK’s position in key growth business segments and open new and exciting business opportunities.
