Qualcomm Technologies announced that the Snapdragon® X75 5G Modem-RF System is continuing to push the boundaries of 5G performance by setting a new world record on sub-6 GHz spectrum, achieving a 7.5 Gbps downlink speed.
This accomplishment builds upon the launch of Snapdragon X75, the world’s first 5G Advanced-ready modem-RF system, announced in February at MWC Barcelona, and underscores the company’s continued efforts to push the boundaries of 5G performance and flexibility.
Conducted through device testing using a 5G standalone (SA) network configuration, this speed was reached by leveraging a total of 300MHz of spectrum, using 4x carrier aggregation (4xCA) with 4 TDD channels in one downlink connection, and 1024 quadrature amplitude modulation (QAM).
Aggregation of 4 TDD channels enables operators to combine their diverse spectrum assets to achieve higher data rates. In addition, 1024 QAM improves spectral efficiency by incorporating more data into each transmission, in comparison to 256 QAM, ultimately allowing for increased data throughput and improved spectrum efficiency.
RF system’s ten other world firsts, empower better user experiences, faster download speeds, increased network capacity, and improved spectrum efficiency. They enable future-ready devices so more demanding data applications, such as video streaming and downloads, online gaming and more, can run smoother than ever, for more users.
Snapdragon X75 is currently sampling to customers, with commercial devices expected to launch in the second half of 2023. For more technical details and information, please see this blog post and visit the Snapdragon X75 webpage.
Sunil Patil, vice president product management, Qualcomm Technologies, Inc
Snapdragon X75 5G Modem-RF System is the smartest wireless modem we have ever created and is designed for the future, with a 5G Advanced ready architecture, made to help operators define the next generation of networks around the world. We look forward to continuing to work with industry leaders to power the best-in-class connectivity experiences and transform industries across consumer, enterprise and industrial use cases.
