Ethernity Networks has signed a contract with a global wireless OEM based in Europe to supply its ENET 4840 40 Gbps FPGA System-on-Chip (SoC) with support for Carrier Ethernet Switching, Wireless Bonding, and IPSec security.
The ENET 4840 is a customized version of the device used within the UEP-20 Universal Edge Platform product design, which will also be supplied to the OEM for manufacturing.
The contract specifies that Ethernity will provide the customer with the company’s ENET 4840 SoC with unique silicon-tuned software, which, thanks to the efficiency of the ENET Flow Processor design, fits into low-cost FPGAs that are capable of meeting prices of mass production and enables up to 40 Gbps of throughput.
The SoC will also come pre-programmed with the IPSec security feature and Ethernity’s newly patented Wireless Bonding feature, which uses load balancing to enable the transmission of a single data flow along multiple wireless streams without the need for point-to-point connection.
David Levi, Ethernity CEO
This is further confirmation from the marketplace that our Universal Edge Platform (UEP) with integrated bonding is an attractive offering. We are confident that it will continue to sell well among wireless connectivity vendors within the 5G backhaul and midhaul market.
