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Samsung Launches New Lineup of 5G Chipsets

Samsung Launches New Lineup of 5G Chipsets Image Credit: Samsung

Samsung Electronics on Tuesday unveiled a range of new chipsets that will be embedded into the company’s next generation 5G solutions. 

The new 3GPP Rel.16 compliant chipsets consist of a third generation mmWave Radio Frequency Integrated Circuit (RFIC) chip, a second generation 5G modem System-on-Chip (SoC) and a Digital Front End (DFE)-RFIC integrated chip. The company’s latest chips will power Samsung’s next-generation products for 5G build out, including the next generation 5G Compact Macro, Massive MIMO radios and baseband units, which will all be commercially available in 2022.

 

The newly introduced chipsets are designed to take Samsung’s next generation 5G lineup to a new level, boosting performance, increasing power efficiency and reducing the size of the 5G solutions.

Samsung’s 3rd generation RFIC chip supports both 28GHz and 39GHz spectrums, and will be embedded in Samsung’s next generation 5G Compact Macro. The chip incorporates advanced technology that reduces antenna size by nearly 50%, maximizing the 5G radio’s interior space. Moreover, the latest RFIC chip improves power consumption, resulting in a more compact-sized, lightweight 5G radio.

Samsung’s new 5G modem SoC will enable Samsung’s forthcoming baseband unit to have twice the capacity, while cutting power consumption in half per cell, in comparison to the previous generation. Moreover, supporting both below-6GHz and mmWave spectrums, it offers beamforming and increased power efficiency for Samsung’s next generation 5G Compact Macro and Massive MIMO radio, while reducing the size for both solutions.

Samsung's new DFE-RFIC integrated chip.chip combines RFIC and DFE functions for both below-6GHz and mmWave spectrums. By integrating these functions, the chip not only doubles frequency bandwidth, but also reduces the size and increases output power for Samsung’s next generation solutions, including 5G Compact Macro.

Junehee Lee, EVP and Head of R&D, Networks Business at Samsung Electronics
This newly unveiled chipset is the fundamental component of our state-of-art 5G solutions, developed through a long-standing R&D effort that enables Samsung to be at the forefront of delivering cutting-edge 5G technologies. As one of the largest semiconductor companies in the world, we are committed to developing the most innovative chips for the next phase of 5G advancement, integrated with the features mobile operators seek to stay competitive.

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Ray is a news editor at The Fast Mode, bringing with him more than 10 years of experience in the wireless industry.

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