MixComm, the mmWave Antennas to Algorithms pioneer, this week announced the latest addition to its portfolio of breakthrough Front End ICs for 5G mmWave.
The SUMMIT 3741 integrates novel power amplifiers, low noise amplifiers, T/R switching, beamformers, calibration, gain control, beam table memory, temperature and power telemetry, and high-speed SPI control for a front-end module with optimal partitioning for 5G infrastructure.
The device is suitable for Antenna-in-Package (AiP) implementations, as well as conventional chip-on-board integration through the use of interposers.
The SUMMIT 3741 also features enhanced digital integration, uniquely enabled by the 45RFSOI (radio-frequency silicon-on-insulator) process of GlobalFoundries (GF), which is said to have inherent advantages over other semiconductor technologies for mmWave applications.
These benefits make the MixComm solutions ideal for 5G infrastructure ranging from gNodeB base stations and repeaters to customer premise equipment. The flexible architecture and ultra-low power operation will also enable 5G hotspots and other user equipment demanding long battery life and sleek form factors.
Dr. Harish Krishnaswamy, MixComm Co-Founder and CTO
5G will continue to push towards the higher mmWave frequency bands, bringing new challenges to conventional approaches. With SUMMIT 3741, we are introducing several ‘firsts’ to the market and look forward to working with our customers to push the envelope for 5G mmWave.
Mike Noonen, MixComm CEO
When we announced our first product in 2020, we highlighted that no other company has as much mmWave and RFSOI design and product experience as MixComm. This deep experience has resulted in many design wins for the Summit 2629 and now the latest breakthrough product in our portfolio, the Summit 3741.
