MediaTek recently unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences.
The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more.
The Dimensity 1200 and 1100 pack a highly integrated 5G modem with MediaTek’s 5G UltraSave technology for big power savings. Both chipsets support every connectivity generation from 2G to 5G, in addition to supporting the latest connectivity features including 5G standalone and non-standalone architectures, 5G carrier aggregation (2CC) across frequency division duplex (FDD) and time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR). The chipsets also integrate 5G HSR Mode and 5G Elevator Mode enhancements to ensure a seamless, reliable 5G connection across networks.
Many OEMs, including Xiaomi, Vivo, OPPO and realme, expressed support for MediaTek’s new Dimensity chip. The first devices with the new MediaTek Dimensity 1200 and 1100 chipsets are expected to hit the market at the end of Q1 and beginning of Q2 this year.
Other industry collaborators and supporters of the new MediaTek 5G chipsets include Arm, China Mobile, Tetras.AI, ArcSoft and Tencent Games.
JC Hsu, Corporate Vice President and General Manager of MediaTek’s Wireless Communications Business Unit
MediaTek continues to expand its 5G portfolio with highly integrated solutions for a range of devices from the high-end to the mid-tier. Our new Dimensity 1200 stands out with its impressive 200MP camera support and advanced AI capabilities, in addition to its innovative connectivity, display, audio and gaming enhancements.
