Deutsche Telekom, together with chipset manufacturer Qualcomm Technologies, module manufacturer Quectel and solution provider Redtea Mobile, are introducing their implementation of nuSIM, an integrated SIM for the Internet of things (IoT).
nuSIM removes the physical SIM - a perfect fit for mobile IoT applications when cost- and power-efficiency paired with unique design advantages are important factors.
For the first time, the nuSIM functionality is now fully integrated on a Qualcomm Technologies chipset. The joint solution has been developed in accordance with Deutsche Telekom's open nuSIM specification. It consists of a nuSIM operating system from Redtea Mobile in a Quectel BG95-M3 module which contains a Qualcomm 9205 LTE Modem.
nuSIM is an integrated SIM solution dedicated to the specific needs of the IoT market. It makes the usual SIM component obsolete by moving the SIM function into the chipset. This creates clear benefits for the device's bill of material, power consumption and overall design. Mobile operator data is added in a secure process at the time of module or device manufacturing. The end customer gets instant connectivity without any additional steps. Commercial availability of nuSIM is planned for later in 2020.
Since the introduction of nuSIM, Deutsche Telekom has partnered with world leading companies in the respective fields of IoT chipsets, modules and digital security. An open specification set ensures interoperability for the secure provisioning of operator credentials during module or device production. Deutsche Telekom is ready to share the technology with other operators and vendors in the IoT segment to extend the growing nuSIM eco-system. Interested parties are welcome to join.
Rami Avidan, Responsible for IoT, Deutsche Telekom
The nuSIM initiative was introduced by Deutsche Telekom at the beginning of last year and quickly adopted by leading IoT industry players around the world. Meanwhile, it has moved from concept stage to real implementations from various partners.
