MediaTek this week unveiled its 5G chipset, a multi-mode, 7nm 5G system-on-chip (SoC) designed to power the first wave of high-end 5G smartphones.
The new 5G SoC is integrated with previously announced MediaTek Helio M70 5G modem that boasts 4.7 Gbps download speeds and 2.5 Gbps upload speeds. The compact design of the SoC includes Arm's newest Cortex-A77 CPU, Mali-G77 GPU and MediaTek's most advanced AI processing unit (APU) to meet the power and performance demands of 5G to deliver super fast connectivity and extreme user experiences.
The 5G chipset supports LTE and 5G dual connectivity (EN-DC) with dynamic power sharing capability, for both 5G stand alone(SA) and non-stand alone (NSA). It supports connectivity from 2G to 4G to bridge existing network access while 5G networks roll out globally.
The new chipset will be ready for lead customer samples in Q3 of 2019 and be in commercial devices by Q1 of 2020.
Joe Chen, President, MediaTek
The industry, OEMs and consumers have high expectations for 5G. We are confident devices powered by MediaTek's 5G chipset, with its impressive architecture, leading imaging features, powerful AI and ultra-fast 5G speeds, will deliver incredible experiences.
