ZTE Selects Intel’s eASIC Devices for its 5G Wireless Products

ZTE Selects Intel’s eASIC Devices for its 5G Wireless Products Image Credit: golubovy/Bigstockphoto.com

Intel announced that ZTE has selected Intel eASIC devices for its 5G wireless products. ZTE selected Intel eASIC devices to meet the critical cost and power requirements demanded by large-scale 5G deployments.

As 5G rollout moves from the trial phase to initial deployment, carriers need flexible solutions based on field programmable gate arrays (FPGAs). FPGAs provide hardware programmability to meet both prototyping and initial production requirements. As the 5G rollout transitions to high-volume production, FPGAs transition to ASICs to meet cost and power targets associated with high-volume shipments. Intel’s recent acquisition of eASIC enables a smooth transition from FPGA-based designs to structured ASICs.

ZTE used FPGAs for rapid prototyping and early production. The company needed to quickly transition to a lower unit cost and reduced-power solution for high-volume deployment.

A structured ASIC is an intermediary technology between FPGAs and standard-cell ASICs that provides unit-cost reduction and improved power efficiency. Structured ASICs offer benefits like those offered by standard-cell ASICs, but with faster development time. Intel eASIC devices are structured ASICs that provide a smooth design transition from any FPGA. They reduce unit cost and power consumption compared to FPGAs. These two benefits are especially important for high volume-markets, such as 5G radio.

ZTE was able to meet time-to-market requirements using FPGAs for its 5G design, said Intel. The smooth transition to an eASIC structured ASIC device reduces the design’s bill of materials (BOM) cost and power consumption, which is required for high-volume production. The combination of FPGAs and Intel eASIC structured ASICs allows customers to meet diverse time-to-market, flexibility, performance, low-power and unit-cost requirements.

The combination of Intel FPGAs, Intel eASIC devices and Embedded Multi-die Interconnect Bridge (EMIB) technology will enable a new device class with flexibility, lower unit cost and power efficiency, all in a single package.

Dan McNamara, SVP and GM of the Programmable Solutions Group, Intel
Intel’s alliance with ZTE marks a major milestone in Intel eASIC devices’ 5G penetration. 5G speeds will enable new classes of applications, resulting in an exponential increase in data volume. Our customers need solutions that allow them to design optimal systems they can take to market quickly.

Duan Xiang Yang, VP and GM of Wireless System Atchitect, ZTE
Intel eASIC devices provide good power and cost benefits for our 5G wireless products and were essential to make a fast transition to meet our low cost and power requirements.

Ray is a news editor at The Fast Mode, bringing with him more than 10 years of experience in the wireless industry.

For tips and feedback, email Ray at ray.sharma(at)thefastmode.com, or reach him on LinkedIn @raysharma10, Facebook @1RaySharma

PREVIOUS POST

NXP Collaborates with Microsoft to Bring AI and ML Capabilities for Anomaly Detection to Azure IoT Users

NEXT POST

Orange Launches the First 'Orange Digital Centre' in Africa and Middle East in Tunisia

THE EDITOR'S DESK

UPCOMING EVENTS

Artelligence 2019

Network Virtualization and SDN Asia

Network Virtualization & SDN Americas

Mobile 360 Digital Societies 2019

TADSummit 2019

MWC Los Angeles 2019

The Digitrans Forum 2019

Mobile 360 Eurasia 2019

ON TWITTER

ON FACEBOOK