Qualcomm is partnerring with Japan’s TDK to create a Singapore-based joint venture (JV), RF360 Holdings to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), automotive applications, connected computing, and more.
Qualcomm will $1.2 billion to own 51 percent of RF360 Holdings and have the option to acquire TDK’s stake at a later date. The total transaction is worth $3 billion.
The JV will enable Qualcomm’s RFFE Business Unit to design and supply products with end-to-end performance and global scale from the modem/transceiver all the way to the antenna in a fully integrated system.
RF360 Holdings will have a comprehensive set of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW), to support the wide range of frequency bands being deployed in networks across the globe. Moreover, RF360 Holdings will enable the delivery of RFFE modules from QTI that will include front-end components designed and developed by QTI. These components include CMOS, SOI and GaAs Power Amplifiers, a broad portfolio of Switches, Antenna Tuning, Low Noise Amplifiers (LNAs) and the industry’s leading Envelope Tracking solution.
In addition to operating the joint venture, Qualcomm and TDK will also deepen their technological cooperation to cover a wide range of cutting-edge technologies for next-generation mobile communications, IoT and automotive applications.