At the Intel Developer Forum (IDF) that commenced yesterday at Shenzhen, China, Intel announced that its Intel Atom x3 (SoFIA) chipset now supports LTE-TDD. The chipmaker giant showcased the first live demonstration of the processor in a smartphone, supporting LTE-TDD connectivity over China Mobile's network. The company also said that the chip will start to ship in the second half of 2015.
Intel also said that the SoFIA chipset will soon extend its support to the Internet-of-Things, citing its roadmap that involves the addition of 3G and LTE processors for IoT applications. Intel's CEO, Brian Krzanich, at the forum, announced additional investments and collaborations by the company to enable it to deliver enhanced value across various IoT supported industries.
In addition, Intel unveiled the Mass Makerspace Accelerator program that aims to find and fund China's next global entrepreneurs, from makers and students to developers and startups, and includes a RMB120 million investment.
Brian Krzanich, CEO, Intel
The local and global impact of our 50 years of Moore's Law innovation and 30 years of strong collaboration and winning together in China is unmatched. Intel remains focused on delivering leadership products and technologies in traditional areas of computing, while also investing in new areas and entrepreneurs – students, makers and developers – to find and fuel future generations of innovation with China.
