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EZchip Intros Highest Core-Count ARM Chip Targeted for NFV/SDN Appliances

EZchip Intros Highest Core-Count ARM Chip Targeted for NFV/SDN Appliances Image Credit: PCC Mobile Broadband

EZchip Semiconductor, a leader in high-performance data-path processing solutions, today unveiled the TILE-Mx multicore processor family that incorporates 100 ARMv8-A 64-bit cores into a single chip, and is specifically targeted for high-performance network applications and network functions virtualization (NFV). The new TILE-Mx is targeted to cater for the increasing traffic loads and rising packet processing complexity that demands more compute power, higher throughput, and greater power efficiency.

According to EZchip, the TILE-Mx is specifically designed to address these challenges through a highly parallel and optimized architecture leveraging proven hardware accelerators from EZchip's market leading network processors, and Tilera's many-core processors with market leading performance-per-watt and linear scaling. In addition, the chip boasts an optimized memory architecture with extremely high bandwidth to both the internal and external memories, and numerous interfaces for 1GE, 10GbE, 25GbE, 40GbE, 50GbE and 100-Gigabit Ethernet as well as PCI-Express, said EZchip.

For NFV and SDN (Software Defined Networking) the TILE-Mx empowers a variety of solutions to offload and accelerate deployments, bringing higher performance and higher applications density, with fewer servers and VMs (Virtual Machines) to manage, said EZchip. The chipmaker also added that the TILE-Mx solutions for NFV and SDN enable platforms such as appliances, blades, intelligent adapters or NFV servers to be optimized for running VNFs (Virtualized Networking Functions), ultimately increasing the throughput and scale, and reducing the power and cost of NFV and SDN deployments.

Eli Fruchter, CEO, EZchip
We are bringing to the market a new type of highly differentiated multicore processor, leveraging the best from EZchip's and Tilera's technologies, and specifically architected to address the next generation of high-performance data center, cloud and carrier networks.

Erik Larsson, Vice President of Marketing, Qosmos
Qosmos leads the market for embedded Deep Packet Inspection (DPI) for SDN and NFV. By combining Qosmos with EZchip, our joint customers can implement new network architectures combining deep network intelligence with very high bandwidth.

Author

Ray is a news editor at The Fast Mode, bringing with him more than 10 years of experience in the wireless industry.

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