Huawei, TM Collaborate on Next-Generation Fixed & 4G Network Innovations

Huawei and Telekom Research & Development (TM R&D) today signed a Memorandum of Understanding (MoU) for joint innovation efforts to co-develop next generation access technologies for both fixed-line and 4G wireless connectivity in Malaysia. The MOU is signed by Dr. Gopi Kurup, Chief Executive Officer, TM R&D and Mike Wang, Chief Executive Officer of Huawei Malaysia at the TM Convention Center

Both the companies will establish a joint lab within the TM Innovation Center in Cyberjaya to share research facilities and encourage knowledge transfer.

Huawei, TM R&D MOU


[Left to Right]: Dr. Leroy G. Blimegger Jr, President of Huawei Assurance & Managed Services, Mr. Zakaria Ahmad, General Manager of TM Research & Development, Giorgio Migliarina, CTIO of Telekom Malaysia, Dr. Gopi Kurup, Chief Executive Officer, TM Research & Development, Dato’ Danapalan TP Vinggrasalam, Chairman of TM Research & Development, Mike Wang, CEO of Huawei Malaysia,   Zou Zhilei, President of Huawei Carrier Business Group, Zhou Jianjun, Vice President of Huawei Southern Pacific Region

"By jointly developing technologies that utilize TM’s existing copper wires, TM can make efficient use of resources, quickly implement bandwidth strategies, and launch additionalnew services, including IPTV and HDTV based on the fast broadband to score more commercial success. After achieving huge success as a fixed network operator, we are very excited to be a part of TM’s transformation into a full-fledged fixed-line and mobile player. TM shares our enthusiasm for bridging the connectivity gap, enhancing Malaysia’s status as an investment destination with world-class connectivity solutions, and continuously enabling the next level of ‘digital life’ for consumers and businesses alike, through ongoing innovation.”

-      Mike Wang, CEO, Huawei Malaysia

“Huawei shares our passion for innovation and co-development partnerships. With strong commitment from both parties, we are confident of contributing to a competitive next generation ICT infrastructure for the nation. The collaboration reflects our commitment to evolve the nation’s HSBB network project and underpins the long term value of TM’s current assets. We believe the next generation access technologies will further enhance our broadband user experience and TM’s wireless coverage in the long run.” 

-      Dr.Gopi Kurup, CEO , TM Research & Development

Ray is a news editor at The Fast Mode, bringing with him more than 10 years of experience in the wireless industry.

For tips and feedback, email Ray at ray.sharma(at), or reach him on LinkedIn @raysharma10, Facebook @1RaySharma


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