Acacia, now part of Cisco, has introduced a new coherent solution with 1.2 terabits per second (1.2T) faceplate pluggable coherent module, highlighting a new 8th generation Coherent Interconnect Module family, powered by Acacia’s Jannu 5nm CMOS digital signal processor (DSP) ASIC.
This solution delivers industry-leading performance with single carrier 1.2T operation and combines the Jannu DSP with 3D Siliconization packaging technology which includes the silicon photonics integrated circuit (SiPh PIC), high-speed modulator driver and transimpedance amplifier (TIA) in a single opto-electronic package.
The Jannu DSP is designed to offer network operators the ability to maximize transmission data rate across a wide range of multi-haul network applications including DCI, metro, long-haul and subsea.
The architecture of the new Coherent Interconnect Module 8 (CIM 8) solution builds upon the success of the Acacia AC1200 product family and aligns closely with the latest client data rates and coherent industry standardization efforts. TheCIM 8 is designed to enable network operators to double their transmission capacity over even greater reaches. For links requiring maximum capacity, the new module can provide 1.2T capacity over a single wavelength.
Dr. Scott Wilkinson, Lead Analyst for Optical Components at Cignal AI
Acacia’s new Coherent Interconnect Module is a great example of market leadership. This solution is a logical next step following the widely adopted Pico DSP-based products and will provide pluggability that is attractive to both traditional and cloud operators.
Christian Rasmussen, Sr. Director, DSP and Optics Engineering and Founder at Acacia
By leveraging the latest 5nm CMOS process node and our advanced signal processing algorithms, we’re delivering exceptional performance with less than half the power per bit of competing solutions, enabling a pluggable deployment model.
