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Murata introduced the Type 2FR connectivity module. The solution is driven by NXP® Semiconductor's RW612 Wireless MCU with integrated Tri-radio…

NXP® Semiconductors and Hon Hai Technology Group (Foxconn) opened a joint laboratory in the Foxconn Nankan Facility in Taiwan, marking…

Parallel Wireless has announced the successful operation of its 5G Open RAN hardware-agnostic solution in the United Kingdom. This deployment,…

NXP® Semiconductors signed an Memorandum of Understanding with Mahindra & Mahindra, a pioneer auto and farm equipment player in India. …

NXP Semiconductors announced the i.MX 91 applications processor family.  Building on more than two decades of leadership in developing multi-market…

NXP Semiconductors announced the EdgeLock SE051H, a secure element designed for Matter, adding to the industry’s broadest portfolio of Matter devices. The…

NXP Semiconductors announced that it has signed a memorandum of understanding with Hon Hai Technology Group (Foxconn) to jointly develop platforms for a…

NXP Semiconductors has announced that it is working with ING Bank N.V. on Project NEAR, ING’s pilot of the industry’s…

Anokiwave, NXP, YTTEK, and Semicomm together demonstrated a complete 5G Radio Unit (RU) from baseband to millimeter-wave (mmW) using the…