PIM Considerations for Board-to-Board Connector Solutions

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PIM Considerations for Board-to-Board Connector Solutions Image Credit: CommScope

Passive intermodulation (PIM) is the generation of interfering or unwanted signals in a passive circuit, component, or connection. These interfering signals can cause a severe decrease in the overall performance of a wireless communication system, impacting the throughput, efficiency, and coverage capability of the network. Some well-known PIM generators in mobile networks include unwanted debris or oxidation in the conducted RF path, loose metal-to-metal contacts in or near the RF path, and metal or ferromagnetic materials in proximity to the conducted or radiated RF path.

As 5G deployments increase and MNO networks continue to become increasingly complex and crowded, these interference and unwanted signals are the last thing that operators want to face. Find out how CommScope's HELIAX board-to-board connector solutions are specially designed to give operators an advantage against performance-eroding PIM.

16 August 2021 / CommScope White Papers / By Ray Sharma